ONTO INNOVATION将亮相湾芯展
2026湾芯展将于10月14-16日在深圳会展中心(福田)盛大举办,届时ONTO INNOVATION INC.将亮相1号馆1H21展位,诚邀产业同仁莅临观展!
ONTO INNOVATION INC.

Onto Innovation总部位于马萨诸塞州威尔明顿,通过其销售与服务网络为全球的客户提供产品与服务。基于Nanometrics和Rudolph Technologies的两家优秀企业的卓越成就,Onto Innovation在半导体价值链中拥有独特的视角,在工艺控制领域独树一帜。我们帮助客户解决最棘手的良率、器件性能、质量和可靠性问题,并且帮助客户使其生产制造过程更加的智能、快速和高效,进而识别并优化其生产制造中的关键工艺路径。
展位号:1号馆1H21
部分展品

Dragonfly G5 System
The Dragonfly G5 system is engineered for inline process control of leading-edge advanced packaging technologies. As the latest generation pattern inspection system in the Dragonfly series, it delivers unparalleled accuracy in detecting submicron defects and performing high-resolution 3D measurements.

The Firefly G5 System
The Firefly G5 system provides automated inspection and 3D metrology for advanced IC substrates and panel level packaging, delivering high resolution and productivity for demanding applications like high-performance computing (HPC), artificial intelligence (AI), cloud computing and machine/deep learning.

Atlas G6 System
The Atlas G6 system is an OCD and thin film metrology tool engineered for the most advanced logic and memory devices. Designed to meet the demands of next-generation AI applications and beyond, it delivers enhanced optics, AI-driven recipe development, and tighter tool matching for superior process control.

Iris G2 System
The Iris G2 system is an advanced optical metrology tool for both common and critical thin films for advanced node, mature and specialty devices, enabling manufacturers to increase transistor speed, reduce power consumption and improve reliability.

FAaST300SL System
The FAaST 300 SL system is a non-contact electrical metrology system that combines both Micro and Macro corona-Kelvin methods into a single platform. It is designed to support advanced R&D as well as high-volume manufacturing environments. The system features automatic robotic wafer handling, dual FOUP Loadport, and is suitable for patterned wafer and monitor wafer measurements.

CnCV system
The CnCV system enables wafer-level characterization of WBG materials without test device fabrication, reducing time and cost. As a mercury-free alternative to MCV, it eliminates contamination concerns. The enhanced Kinetic CV mode with UV-assisted corona charge neutralization achieves high throughput and precision for fast, reliable process control.

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