CIPA 2025：第十七届集成电路封测产业链创新发展论坛暨长三角集成电路先进封装发展大会议程

曹立强  国家集成电路封测产业链技术创新战略联盟秘书长、中国科学院微电子研究所副所长

Liqiang Cao, Secretary-General of the National IC Packaging and Testing Industry Technology Innovation Strategic Alliance, and Deputy Director of the Institute of Microelectronics, Chinese Academy of Sciences

领导致辞 Leadership Speeches

叶甜春 中国集成电路创新联盟副理事长兼秘书长

Ye Tianchun, Vice Chairman and Secretary-General of the China Integrated Circuit Innovation Alliance

中国先进封装产业回顾及展望

Retrospect and Prospect of China's Advanced Packaging Industry

杨士宁 博士 芯盟科技董事长、新芯股份董事长、长存控股副董事长

Dr. Simon YANG, Chairman of ICLEAGUE & XMC, Deputy Chairman of Yangtze Memory Technologies Co.,Ltd. (YMTC)

三维存储与三维集成发展趋势

Development Trends of 3D NAND and 3D Integration

尹首一 清华大学集成电路学院副院长

Shouyi Yin, Vice Dean of the School of Integrated Circuits at Tsinghua University

高算力芯片发展路径探讨-从计算架构到集成架构

Exploration of Development Paths for High-Performance Computing Chips: From Computing Architecture to Integration Architecture

邹广才 中国汽车芯片产业创新战略联盟副秘书长

Zou Guangcai, Deputy Secretary-General, China Automotive Chip Industry Innovation Strategic Alliance

中国汽车芯片发展概况和先进封装需求

Overview of China's Automotive Chip Development and Demand for Advanced Packaging

刘丰满 博士 华进半导体封装先导技术研发中心有限公司副总经理

Dr. Liu Fengman, Vice President of National Center for Advanced Packaging Co.,Ltd.(NCAP China)

面向系统集成的先进封装技术

advanced packaging technology for system integration

刘伟平 北京华大九天科技股份有限公司董事长

Liu Weiping, Chairman of Beijing Empyrean Technology Co.,Ltd.

三维集成芯片时代EDA发展趋势

Trends of EDA in the Era of 3D Integrated Chips

午休及观展 Lunch Break and Exhibition Viewing

郑礼英  华进半导体封装先导技术研发中心有限公司副总经理

Zheng LiYing, Vice President, National Center for Advanced Packaging Co.,Ltd.

张玉明 华天科技首席科学家

Yuming Zhang, Chief Scientist, Huatian Technology

筑芯强基，智启全球---中国封测的转型突破与生态构建

Building a Strong Foundation, Driving Global Intelligence: Transformation Breakthroughs and Ecosystem Development in China's Packaging & Testing Industry

刘勤让 国家数字交换系统工程技术研究中心副主任

LIU Qinrang, Vice-dircetor, National Digital Swithing System Engineering & Technology R&D Center

从脑神经网络思考集成互连的发展趋势 

Consider the development trend of integrated interconnection from the perspective of brain neural networks

谢鸿 博士 通富微电子股份有限公司副总裁

Dr. Hong Xie, CVP, TF Microelectronics

先进封装的趋势和最新进展

Latest trends & developments of advanced packaging

马德 浙江大学计算机学院副教授、博导

De Ma, Associate Professor and Doctoral Supervisor, College of Computer Science and Technology, Zhejiang University

类脑计算芯片与系统

Brain-inspired Computing Chips and Systems

郭超 青禾晶元半导体科技(集团)有限责任公司副总经理

Chao Guo,Deputy general manager of iSABers Group Co., Ltd.

先进封装时代的半导体键合集成技术

Semiconductor bonding integration technology in the era of advanced packaging

于大全 厦门云天半导体科技有限公司董事长

DaquanYu, Chairman, Xiamen Sky Semiconductor Technology Co.,Ltd.

玻璃基板技术及其产业化挑战

Glass Substrate Technology and its Industrialization Challenges

陈钏 中国科学院微电子研究所副研究员

Chen Chuan, Associate Research, INSTITUTE OF MICROELECTRONICS OF CHINESE ACADEMY OF SCIENCES

算力芯片三维集成散热挑战与发展趋势

Challenges and Trends in Cooling of 3D Integrated High Performance Computing Chip

李太龙 江苏长电科技股份有限公司汽车电子技术市场部高级经理

Li Taylor, Senior Manager, JCET

协同创新，驱动未来——汽车电子封测产业链的变革与机遇

Collaborative Innovation, Driving the Future – Transformation and Opportunities in the Automotive Electronics Packaging and Testing Industry Chain

彭洪修 安集微电子科技（股份）有限公司副总经理

Libbert Peng, Vice President of Anji Microelectronics Technology (Shanghai) CO.,LTD.

先进封装电镀技术挑战及解决方案

Challenge and Solution of Advanced Packaging Plating Technology