第十八届IEEE
国际固态和集成电路技术会议
2026 IEEE 18th International Conference on Solid-State and Integrated Circuit Technology (ICSICT)
•
2026年10月27日-30日
中国 · 杭州
会议简介
由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办，电子科技大学长三角研究院（湖州）承办的 2026 IEEE 第十八届国际固态和集成电路技术会议（2026 IEEE 18th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2026），定于2026年10 月27日至30日在杭州举办。作为中国每两年一届的顶尖学术盛会，ICSICT是固态器件与集成电路领域规模最大、影响力最深远的国际会议之一。
本届会议聚焦固态数字集成电路与系统设计、模拟电路、器件研发、工艺技术等核心方向，为期四天的议程将通过口头报告、海报展示、专题研讨及特色活动等多元形式，全面呈现全球该领域的前沿突破与创新成果。会议以“推进集成电路技术进步、促进产学研深度融合”为宗旨，届时将有来自世界各国和地区学术界、产业界的 500 余位杰出代表齐聚杭州，共话技术发展趋势，探索产业应用前景。
ICSICT
Co-sponsored by
ICSICT
Technically Co-sponsored by
ICSICT
Hosted by
ICSICT
Supported by
ICSICT
Media Partner
会议组委会
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Life Honorary Chair
Yangyuan Wang, Peking University, China
Advisory Committee Co-Chairs
Ting-Ao Tang, Fudan University, China
Cor Claeys, Proximus, Belgium
Mengqi Zhou, IEEE China Council, China
General Chairs
Jan Van der Spiegel, University of Pennsylvania, USA
Bin Zhao, IEEE EDS, USA
Francois Rivet, University of Bordeaux, France
Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China
General Co-Chairs
Ning Xu, Wuhan University of Technology, China
Cheng Zhuo, Zhejiang University, China
Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Gaofeng Wang, Hangzhou Dianzi University, China
Technical Program Committee Chairs
Haruo Kobayashi, Gunma University, Japan
Ming Li, Peking University, China
Bo Zhang, University of Electronic Science and Technology of China, China
Yi Zhao, Huada Semiconductor, China
Technical Program Committee Co-Chairs
Bei Yu, The Chinese University of Hong Kong, China
Zheng Wang, University of Electronic Science and Technology of China, China
Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia
Ling Zhang, Zhejiang University, China
Yuchao Yang, Peking University, China
Jing Jin, Shanghai Jiao Tong University, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Local Arrangement Chair
Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Subcommittee Chairs
Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Wentong Zhang, University of Electronic Science and Technology of China, China
Jing Jin, Shanghai Jiao Tong University, China
Yuchao Yang, Peking University, China
Subcommittee Co-Chairs
Hailong Jiao, Peking University, China
Zheng Wang, University of Electronic Science and Technology of China, China
Jin Wei, Peking University, China
Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Special Session Chair
Haimeng Huang, University of Electronic Science and Technology of China, China
Tutorial Chair
Wei Mao, Xidian University, China
Industry Liaison Chairs
Sylvain Eimer, Truth Equipment, China
Preet Yadav, NXP Semiconductors, India
Publicity Co-Chairs
Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
Publication Committee Chair
Mengqi Zhou, IEEE China Council, China
Publication Committee Co-chairs
Lobna A. Said, Nile University, Egypt
Guoqing Deng, Sichuan Institute of Electronics, China
Treasurer
Jianhong Zhou, Xihua University, China
Secretary General
Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China
征稿主题
Theme 1: Digital & System Level IC
Chair: Yuchao Yang, Peking University, China
Co-Chair: Hailong Jiao, Peking University, China
Track 1: Digital Architectures & Systems
Chair:
Zhiyi Yu, Sun Yat-sen University, China
Co-Chairs:
Yaoyu Tao, Peking University, China
Hongyang Jia, Tsinghua University, China
Track 2: Digital Circuits
Chair:
Yongpan Liu, Tsinghua University, China
Co-Chairs:
Yanan Sun, Shanghai Jiao Tong University, China
Fengbin Tu, Hong Kong University of Science and Technology, China
Track 3: Design Methodology & EDA
Chair:
Jun Yang, Southeast University, China
Co-Chairs:
Yibo Lin, Peking University, China
Yu Li, Zhejiang University, China
Theme 2: Analog
Chair: Jing Jin, Shanghai Jiao Tong University, China
Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China
Track 4: RF & Wireless
Chair:
Keping Wang, Tianjin University, China
Co-Chairs:
Jian Pang, Shanghai Jiao Tong University, China
Kai Tang, Hunan University, China
Track 5: Wireline
Chair:
Xiaoyan Gui, Xi'an Jiaotong University, China
Co-Chairs:
Bingyi Ye, East China Normal University, China
Yuekang Guo, Shanghai Jiao Tong University, China
Track 6: General Analog
Chair:
Lin Cheng, University of Science and Technology of China, China
Co-Chairs:
Junmin Jiang, Southern University of Science and Technology, China
Ang Hu, Huazhong University of Science and Technology, China
Theme 3: Devices
Chair: Wentong Zhang, University of Electronic Science and Technology of China, China
Co-Chair:Jin Wei, Peking University, China
Track 7: CMOS Logic Devices & Sensors
Chair:
Heng Wu, Peking University, China
Co-Chairs:
Wang Kang, Beihang University, China
Xiaosheng Zhang, University of Electronic Science and Technology of China, China
Track 8: Power Devices & Power IC
Chair:
Long Zhang, Southeast University, China
Co-Chairs:
Jiafei Yao, Nanjing University of Posts and Telecommunications, China
Zekun Zhou, University of Electronic Science and Technology of China, China
Track 9: Device Reliability & Security
Chair:
Mengyuan Hua, Southern University of Science and Technology, China
Co-Chairs:
Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China
Zhao Qi, University of Electronic Science and Technology of China, China
Theme 4: Process & Technologies
Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China
Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China
Track 10: Semiconductor Process Technologies
Chair:
Bobo Tian, East China Normal University, China
Co-Chairs:
Min Liao, Xidian University, China
Li Zhu, Nanjing University of Posts and Telecommunications, China
Track 11: Optoelectronics and Silicon Photonics Integration
Chair:
Linfeng Sun, Beijing Institute of Technology, China
Co-Chairs:
Ming Xu, Huazhong University of Science and Technology, China
Yuanfang Yu, Nanjing University of Posts and Telecommunications, China
Track 12: Packaging Technologies
Chair:
Jun Zhang, Nanjing University of Posts and Telecommunications, China
Co-Chairs:
Shenyang Mo, NARI Semiconductor R&D Center, China
Pengfei Zhao, Nanjing University of Posts and Telecommunications, China
投稿方式
投稿作者需按照论文模板撰写论文，提交至少3页的英文文章，被录用文章将收录于会议论文集。
扫描上方二维码
或前往easychair投稿
https://easychair.org/conferences/?conf=icsict2026
👇 扫码查看投稿要求/下载论文模板 👇
投稿要求
论文模板
重要时间
征稿截止日期：2026年6月25日
录用通知日期：2026年7月25日
组织特别分会
ICSICT 2026组委会邀请专家学者积极组织特别分会，展示自己的先进研究成果！
有意组织的学者请在2026年2月1日前将提案发送至会议邮箱。（ieeeicsict@outlook.com）。
提案模板
通过下方链接下载：
https://www.icsict.org/ICSICT_2026_Special_Session_Proposal_Template.docx
相聚杭州
杭州市，坐落于风景如画江浙腹地，是一座以永恒之美和丰富文化遗产闻名的城市。
杭州最著名的景点之一是西湖，它被联合国教科文组织列为世界遗产。除此之外，京杭大运河、灵隐寺、钱塘江以及新兴升起的电子商务产业，都让这座富有历史底蕴的城市散发新的光芒。
ICSICT 2026组委会诚挚邀请您参与会议，于金秋10月相约在这座美丽的城市！
联系方式
会议秘书：钟女士
联系电话：+86-186 282 638 76
会议邮箱：
icsict2026@csj.uestc.edu.cn
ieeeicsict@outlook.com
会议官网：www.icsict.org
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